X-Ray Solution AX7900

The X-Ray Solution AX7900 is an advanced, high-resolution X-ray inspection system designed for non-destructive testing (NDT) of electronic assemblies, semiconductors, and PCB components. Equipped with micro-focus X-ray technology, this machine provides ultra-clear imaging for precise defect detection, ensuring quality control in manufacturing and failure analysis processes.

With automated inspection capabilities, real-time image processing, and a 360° rotational stage, the AX7900 is an essential tool for solder joint analysis, BGA/SMT component inspection, and internal structural verification of critical electronic components.

X-Ray Solution X6600

Product Features

  • High-Resolution X-Ray Imaging – Captures detailed internal structures with precision magnification.
  • Non-Destructive Testing (NDT) – Allows comprehensive inspection without damaging components.
  • 360° Rotational Inspection – Ensures full-angle defect detection for BGAs, QFNs, and solder joints.
  • Automated Defect Detection (AI-Based) – Identifies voids, misalignment, bridging, and micro-cracks.
  • User-Friendly Interface – Windows-based software with touchscreen control for seamless operation.
  • Adjustable X-Ray Intensity – Customizable for different material densities and component types.
  • Real-Time Image Processing & Data Logging – Captures and exports SPC reports for quality assurance.
  • Fully Shielded for Operator Safety – Designed to meet international X-ray safety standards.

Product Applications

  • Electronics Manufacturing – Inspection of BGA, CSP, QFN, and SMT solder joints.
  • Semiconductor Industry – Chip packaging and wafer-level defect analysis.
  • Automotive Electronics – Ensuring quality in ECU, power modules, and sensor assemblies.
  • Aerospace & Defense – Critical PCB and component inspection for mission-critical systems.
  • Medical Device Manufacturing – Verification of PCBs in diagnostic and imaging equipment.
  • Telecommunications & Industrial Electronics – Reliability testing for high-end electronic devices.
  • Research & Development (R&D) – Prototyping and failure analysis for new product development.

Technical Parameters

SYSTEM SUMMARY
Footprint : 1100 (W) X 1100 (D) X 1500 (H) mm Plywood Packing Size : 135 (W) x 135 (D) x 180 (H) cm
Machine : 1100 kg Packing Weight : 1300 kg
Power Supply : AC 110~220V, 50/60Hz Power Consumption : 1.0 kw
X-RAY TUBE
Tube Type : Sealed Max. Power : 8W
Voltage : 0~90kV (Adjustable) Focus Spot Size : 5μm
IMAGING SYSTEM
Detector : Flat Panel Detector (FPD) Pixel Size : 85μm
Effective Detection Area : 65 x 65mm Frame Rates : 40fps
Pixel Matrix : 768 x 768 System Magnification : 600x
SOFTWARE
Auto-measuring : BGA Soldering Voids Auto-measuring and Support Data/Graphic Output
Multiple Measuring Tools : Support Measuring Distance, Angle, Diameter, Polygon, PTH filling rate, etc.
CNC Mode : CNC Programmable inspection, Easy Operation and User Friendly.
Real-time Display : Real-time Displaying the Working Data of Voltage, Current, Angle, Date, etc.
Navigation : Convenient Target Point Positioning System.
MOTION CONTROL SYSTEM INDUSTRIAL PC
Movement Control : Joystick, Keypad & Mouse Monitor : 24” FHD LCD Display
Max. Loading Area / Weight : 520 x 420mm / 5kg System OS : Windows 10 64bit
Max Inspection Area : 460 x 400mm Hard disk : 1TB
Tilting Angle : ±360° RAM : 8GB
Manipulator : 8-axis with X / Y / Z1 / Z2 / T CPU model : Intel i7 Processor
OTHER FEATURES
Energy Saving : X-Ray Auto-off When it’s out of work Over than 5 minutes Safety Operation : Electromagnetic Interlock and Warning Light
Authority Management : Password Management X-Ray Safety : < μ1Sv/h